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Toshiba America Electronic Components. (TAEC) has announced a new
single-chip high-definition (HD) digital multimedia decoder device
with an integrated 64-bit 200 megahertz (MHz) MIPS-based reduced
instruction set computer (RISC) TX49 central processing unit (CPU),
an MPEG-2 decoder and peripherals. Target applications for the TC81240TBG
include HD set-top boxes and HDTVs incorporating the receiver for
satellite, cable and terrestrial digital broadcasts as well as many
new applications requiring HD capabilities.
An official release informs that Toshiba's engineers designed the
TC81240TBG HD digital multimedia decoder to address system requirements
for the digital consumer vertical market segment.
The key features of the TC81240TBG include:
* Can decode four channels of standard-definition television.
* It uses unified memory architecture; the same memory chips can
be used for the CPU and multimedia functions.
* It also supports multiple audio standards, including Advanced
Audio Coding, Dolby Digital, MPEG-1 layers 1, 2 and 3.
* It incorporates high-quality video capture and display functions.
* In addition it contains a versatile scaler to output multiple
pictures on the screen.
The release states that digital broadcasting is the future of television
and the adoption of digital TVs is expected to accelerate rapidly
as a result of the Federal Communications Commission ruling that
36-inch or larger TVs must have integrated tuners and MPEG decoders.
Toshiba initially supported digital TV makers with a three-part
chip set for the back-end system of digital receivers; these three
ICs are now integrated in the TC81240TBG.
Along with a reduced parts count, Toshiba incorporated upgraded
functions into the new device. Enhanced MPEG-2 decoding capability
now allows simultaneous decoding of two HD channels, and the CPU
operating frequency was increased from 32-bit 133MHz to 64-bit 200MHz.
The device supports additional interfaces, including USB, and also
features unified memory architecture.
Combining quality and flexibility with design engineering expertise,
TAEC brings a breadth of advanced, next-generation technologies
to its customers. This broad offering includes semiconductors, flash
memory-based storage solutions, optical communication devices, displays
and rechargeable batteries for the computing, wireless, networking,
automotive and digital consumer markets.
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