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Toshiba's single-chip HD digital multimedia decoder chip
 
Indiantelevision.com Team

(23 April 2003 4:00 pm)
 

Toshiba America Electronic Components. (TAEC) has announced a new single-chip high-definition (HD) digital multimedia decoder device with an integrated 64-bit 200 megahertz (MHz) MIPS-based reduced instruction set computer (RISC) TX49 central processing unit (CPU), an MPEG-2 decoder and peripherals. Target applications for the TC81240TBG include HD set-top boxes and HDTVs incorporating the receiver for satellite, cable and terrestrial digital broadcasts as well as many new applications requiring HD capabilities.

An official release informs that Toshiba's engineers designed the TC81240TBG HD digital multimedia decoder to address system requirements for the digital consumer vertical market segment.

The key features of the TC81240TBG include:

* Can decode four channels of standard-definition television.

* It uses unified memory architecture; the same memory chips can be used for the CPU and multimedia functions.

* It also supports multiple audio standards, including Advanced Audio Coding, Dolby Digital, MPEG-1 layers 1, 2 and 3.

* It incorporates high-quality video capture and display functions.

* In addition it contains a versatile scaler to output multiple pictures on the screen.

The release states that digital broadcasting is the future of television and the adoption of digital TVs is expected to accelerate rapidly as a result of the Federal Communications Commission ruling that 36-inch or larger TVs must have integrated tuners and MPEG decoders. Toshiba initially supported digital TV makers with a three-part chip set for the back-end system of digital receivers; these three ICs are now integrated in the TC81240TBG.

Along with a reduced parts count, Toshiba incorporated upgraded functions into the new device. Enhanced MPEG-2 decoding capability now allows simultaneous decoding of two HD channels, and the CPU operating frequency was increased from 32-bit 133MHz to 64-bit 200MHz. The device supports additional interfaces, including USB, and also features unified memory architecture.

Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes semiconductors, flash memory-based storage solutions, optical communication devices, displays and rechargeable batteries for the computing, wireless, networking, automotive and digital consumer markets.

 
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